Resumen

VICENTE-HERNANDEZ, Ascensión  y  BRAVO-GONZALEZ, Luis Alberto. Shear bond strength of the APC Plus system: «In vitro» study. RCOE [online]. 2005, vol.10, n.1, pp.61-65. ISSN 1138-123X.

The objective of this study was to compare the shear bond strength and the amount of remnant adhesive on the tooth after the debonding of APC Plus precoated brackets (3M) and uncoated brackets bonded with the resin Transbond XT (3M), conditioning the enamel in both cases with the self-etching primer Transbond Plus Self Etching Primer (TSEP, 3M). No significant differences were observed in the bond strength of the two groups evaluated (p0,05). TSEP/APC Plus left significantly less adhesive on the tooth than TSEP/Transbond XT (p<0.05). SEM observations of the enamel treated with TSEP showed a porous and potentially retentive surface for orthodontic bonding needs. We deduce from our results that the use of combined TSEP with APC Plus precoated brackets can be useful, reducing the chair time without compromising the bond strength.

Palabras clave : APC Plus; Self-etching primers; Brackets bonding.